When a component is mounted to a heat sink, ____ is generally used to ensure a good thermal contact between the device and the heat sink.
A) thermal compound
B) insulation compound
C) resistance compound
D) break compound

Name: When a component is mounted to a heat sink, ____ is generally used to ensure a good thermal contact between the device and the heat sink. A) thermal compound B) insulation compound C) resistance compound D) break compound
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Question

When a component is mounted to a heat sink, ____ is generally used to ensure a good thermal contact  between the device and the heat sink.
A) thermal compound
B) insulation compound
C) resistance compound
D) break compound

Quizplus · Accepted Answer

The Answer is A

When a Component Is Mounted to a Heat Sink, ____