____ is used to fill in the gaps between the two surfaces and provide good thermal contact.
A) Insulation compound
B) Thermal compound
C) Break compound
D) Lock compound
Correct Answer:
Verified
Q1: The surface of the device and heat
Q2: When a component is mounted to a
Q3: Heat sinks vary in size and shape,
Q4: Using thermal compound when heat sinking components
Q5: The thermal compound that is greasy and
Q6: Small heat sinks are generally used when
Q7: The purpose of a heat sink is
Q8: Electrical and electronic components have a power
Q9: The _ rating indicates the amount of
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