New Perspectives on Computer Concepts
Quiz 2: Digital Devices
A dual in-line package (DIP) is a square chip package, typically used for microprocessors, with pins arranged in concentric squares.
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Semiconductors are substances with properties between those of a conductor and an insulator.
Land-grid arrays (LGAs) have two rows of pins that connect the chip to a circuit board.
Component systems are currently the most popular form factor for digital devices.
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